U0406FC08C spec: 8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards

U0406FC08C Podobné

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U0406FC08C Datasheet a Spec

Balení :

Špendlíky : 0

Teplota : Min -55 °C | Max 150 °C

Velikost : 122 KB

Aplikace : 8.0V; 250W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards