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ULC0402FC08C spec: 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
ULC0402FC08C Podobné
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- 5.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
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- 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
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- 12.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
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- 15.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
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- 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
ULC0402FC08C Datasheet a Spec
Výrobcem : Protek Devices
Balení : U0402
Špendlíky : 0
Teplota : Min -55 °C | Max 150 °C
Velikost : 177 KB
Aplikace : 8.0V; 200W; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
ULC0402FC08C PDF Download